Perio Protect®
Perio Protect® is a comprehensive method of cleaning customized for each individual patient to help manage biofilms*, communities of bacteria, growing in the spaces or pockets between teeth and gum tissue. The overall goal of the Perio Protect Method™ is to manage oral biofilm with minimally invasive dentistry for lasting oral health.
Bacterial infections develop when food, bacteria, and tartar are left on the teeth.
Infection can develop along the gum line with bacteria forming a community called a biofilm. Biofilm grows down into the space or pocket that develops between the teeth and gum tissue. The biofilm is protected by a slimy covering produced by the bacteria in the community.
The Perio Protect® Method is a combination of treatments, including a non-invasive chemical debriding* therapy used in conjunction with traditional mechanical debriding procedures.
The chemical therapy consists of tray delivery of doctor-prescribed solutions to chemically debride biofilm from the periodontal pocket and alter the pocket's microbiological environment to disrupt biofilm growth.
We have seen a reduction in periodontal pockets by up to 4 mm and patients express how clean their mouths feel after each use and overall since starting the treatment. Results will vary based on the progression of the periodontal condition and on how diligently the home care instruction is followed.
This program is for patients of all types. From those who have family histories of periodontal disease, but no current symptoms, to patients who have advanced periodontal disease.
*biofilm - A thin, slimy film of bacteria that adheres to a surface.
*Debriding - In oral hygiene and dentistry, debridement refers to the removal of plaque and calculus that have accumulated on the teeth. Debridement in this case may be performed using ultrasonic instruments, which fracture the calculus, thereby facilitating its removal, as well as hand tools, including periodontal scaler and curettes, or through the use of chemicals such as hydrogen peroxide.